Microship 微芯 HV53011T-E/KVX 封装:TFBGA59 PN:HV53011T-E/KVX

商品编号:OK000000224065

名称:HV53011T-E/KVX 

封装/规格:TFBGA

品牌/产地:Microchip

产品型号PN:HV53011T-E/KVX 

描述:16-Ch. ±135V Push-Pull Driver with RTZ, Current Sense for Haptic and Piezo Drive

级别:工业级

发货情况:现货,16点前下单当天发货

库存:现货库存

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  • 商品名称:Microship 微芯 HV53011T-E/KVX 封装:TFBGA59 PN:HV53011T-E/KVX
  • 商品编号:OK000000224065
  • 品牌:
  • 库存: 8910
  • 名称:HV53011T-E/KVX 
  • 封装/规格:TFBGA
  • 品牌/产地:Microchip
  • 产品型号PN:HV53011T-E/KVX 
  • 描述:16-Ch. ±135V Push-Pull Driver with RTZ, Current Sense for Haptic and Piezo Drive
  • 级别:工业级
  • 发货情况:现货,16点前下单当天发货
  • 库存:现货库存

HV53011T-E/KVX


16-Channel ±135V Push-Pull Driver with RTZ


带 RTZ 的 16 通道 ±135V 推挽式驱动器

特征

16通道推挽输出

归零 (RTZ) 和高阻抗 (Hi-Z)

功能

高达±135V的输出电压

24mAMinimumSourceSinkOutputCurrent

250pF最大输出负载

电流传感器输出

具有四锁存 2 位每通道架构的 SPI 接口

上电复位功能

关机功能

59-Ball8x8mmTFBGA封装

应用

• SurfaceHapticApplication • MEMSDriver

• 压电驱动器

一般说明

HV53011 是用于表面触觉应用的高压驱动器解决方案。它由 16 个推挽式驱动器组成,能够提供 ±135V 输出摆幅并具有归零 (RTZ) 功能。每个输出驱动器能够提供和吸收至少 24 mA 的电流。每个高压输出能够驱动高达 250 pF 的容性负载。该器件还集成了全局电流传感器功能,以监控充电和放电电流。测得的电流通过电流检测电阻映射到比例因子为 3.1 V/V 的低压模拟输出。

SPI 接口用于在微控制器/处理器和高压驱动器之间进行通信。该接口接受时钟速度高达 32 MHz 的 3.3V 逻辑 I/O 信号。五个数字 LATCH 控制信号管理数据流和触发模式。它将输出建立为四种可能状态之一:VPP、VNN、0Vorhighimpedance。

正确的通电和断电顺序对于确保高压驱动器的运行至关重要。该驱动器需要四个高压电源轨 VPP、VPF、VNN、VNF 和三个低压电源轨 VCC、VSS 和 VLL。配套的集成驱动器 IC HV53001 具有内置的电源开/关顺序控制电路以保持正确的顺序。

关闭功能可用于禁用驱动程序并将其设置为在不使用驱动程序时消耗最小功率。

HV53011 器件采用 8x8mm 59 球 TFBGA 封装。为安全起见,所有高压 I/O 都分配有足够的间隙。

Features

  • 16-Channel Push-Pull Output

  • Return-To-Zero(RTZ)andHighImpedance(Hi-Z)

    Function

  • Upto±135VOutputVoltage

  • 24mAMinimumSourceSinkOutputCurrent

  • 250pFMaximumOutputLoad

  • Current Sensor Output

  • SPI Interface with Quad-Latched 2-Bit per Channel Architecture

  • Power-OnResetFunction

  • Shutdown Function

  • 59-Ball8x8mmTFBGAPackage

    Application

    • SurfaceHapticApplication • MEMSDriver
    • PiezoDriver

General Description

HV53011 is a high-voltage driver solution for surface haptic applications. It consists of 16 push-pull drivers capable of ±135V output swing with Return-To-Zero (RTZ) function. Each output driver is capable of sourc- ing and sinking at least 24 mA. Each high-voltage out- put is capable of driving up to 250 pF capacitive load. A global current sensor function is also integrated into this device to monitor the charge and discharge cur- rents. The measured current is mapped to a low volt- age analog output with a scale factor of 3.1 V/V via a current-sensing resistor.

An SPI interface is used to communicate between the microcontroller/processor and the high-voltage drivers. This interface accepts 3.3V logic I/O signals up to clock speeds of 32 MHz. Five digital LATCH control signals manage the data flow and the firing pattern. It estab- lishes the output to one of four possible states: VPP, VNN,0Vorhighimpedance.

A proper power on and off sequence is critical to ensure the operation of the high-voltage driver. This driver requires four high-voltage power rails, VPP, VPF, VNN, VNF, and three low-voltage power rails, VCC, VSS and VLL. A companion integrated driver IC, HV53001, has a built-in power on/off sequence control circuits to maintain the proper orders.

A shutdown function is available to disable the driver and set it to consume minimum power when the driver is not used.

The HV53011 device is packaged in a 8x8mm 59-ball TFBGA package. All high-voltage I/Os are assigned to have sufficient clearance for safety purposes.


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